Thermal physics

Results: 2207



#Item
991Index • Symbols • AL  μ (micro) prefix, 20

Index • Symbols • AL μ (micro) prefix, 20

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Source URL: media.wiley.com

Language: English - Date: 2013-08-25 07:09:52
992Entropy-based Mesh Refinement, I: The Entropy Adjoint Approach Krzysztof J. Fidkowski ∗ and Philip L. Roe † Department of Aerospace Engineering, University of Michigan, Ann Arbor, MI[removed]This work presents a mesh

Entropy-based Mesh Refinement, I: The Entropy Adjoint Approach Krzysztof J. Fidkowski ∗ and Philip L. Roe † Department of Aerospace Engineering, University of Michigan, Ann Arbor, MI[removed]This work presents a mesh

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Source URL: www-personal.umich.edu

Language: English - Date: 2009-06-12 12:48:17
993THE TITLE OF YOUR PAPER GOES HERE

THE TITLE OF YOUR PAPER GOES HERE

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Source URL: www.cfd.com.au

Language: English - Date: 2006-11-14 03:32:13
994PHYxxxx Everyday Physics  Boiling an Egg Boiling an Egg Consider a spherical homogeneous egg of specific heat capacity c, density !, thermal conductivity

PHYxxxx Everyday Physics Boiling an Egg Boiling an Egg Consider a spherical homogeneous egg of specific heat capacity c, density !, thermal conductivity "

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Source URL: newton.ex.ac.uk

Language: English - Date: 2008-04-04 13:07:06
995Code: AE04  MATERIALS AND PROCESSES Code: AE04 PART - I

Code: AE04 MATERIALS AND PROCESSES Code: AE04 PART - I

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Source URL: iete-elan.ac.in

Language: English - Date: 2011-01-06 05:54:04
996P1: SFK Color: 1C ind BLBS071-Sandeep  January 12, 2011

P1: SFK Color: 1C ind BLBS071-Sandeep January 12, 2011

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Source URL: media.wiley.com

Language: English - Date: 2013-08-26 16:18:24
997THERM-X-TROL® Thermal Expansion Absorbers, ST-450 Series (Non-ASME) 150 PSIG Working Pressure Model No.

THERM-X-TROL® Thermal Expansion Absorbers, ST-450 Series (Non-ASME) 150 PSIG Working Pressure Model No.

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Source URL: s3.supplyhouse.com

Language: English - Date: 2014-01-10 13:11:43
998HIGH CURRENT PROPERTIES OF A MICROSPRING CONTACT FOR FLIP CHIP PACKAGING

HIGH CURRENT PROPERTIES OF A MICROSPRING CONTACT FOR FLIP CHIP PACKAGING

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Source URL: www.ee.washington.edu

Language: English - Date: 2010-04-28 10:14:48
999Microsoft Word - TEC_final1-kb.doc

Microsoft Word - TEC_final1-kb.doc

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Source URL: www.ee.washington.edu

Language: English - Date: 2009-02-22 20:16:51
1000arXiv:math-ph/0003028v1  24 Mar 2000

arXiv:math-ph/0003028v1 24 Mar 2000

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Source URL: arxiv.org

Language: English - Date: 2008-02-05 11:38:53